***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Feb 21, 2025                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt P6SMB8P2A  A K 
.param
+vc0 = 1.046e-13	      vc1 = 7.016e-11		vc2 = 1.000e0		vc3 = 1.513e-8		vc4 = 9.375e-1
+tc1 = 1.308e-0		tc2 = 2.745e-2		tc3 = 6.408e-3		tc4 = 4.095e-3
.func irexp(v) {(vc0+vc1*v**vc2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc3*exp(vc4*v))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.func rbv(i) {2.311e-2*min(i,0)}
d1 A A1 zener
g1 A1 A value = {irexp(v(A1,A))}
v1 A1 K1 0
e1 K1 K value = {rbv(i(v1))}
.model zener d
***** flag parameter *****
+level = 1 
***** dc model parameter *****
+ is = 3.676e-13	       n = 1.110         rs = 9.958e-3
+ibv = 1.0e-2		 nbv = 1.000	  bv = 8.20
+ikf = 5.363
***** capacitance parameter *****
+cjo = 3.150e-9	   m = 3.424e-1		  vj = 6.975e-1
+ fc = 0.5
***** temperature coefficient *****
+tnom = 25		      eg = 1.080		      xti = 3
+trs1=-2.040e-3         tikf=-3.455e-3       
+tbv1 = 4.777e-4	      tbv2 = 1.629e-7
.ends P6SMB8P2A
*$
